IC/transistor sockets

Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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Manufacturer / More information		 QTY Date
Code		 Unit Price Minimum Order Quantity /
Standard Packing Quantity		 Estimated Ship Date ECAD Model Description
CoreStaff Part Number		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
Quality Guaranteed
B-1 		Supplier Stock

4-1571552-2
TE CONNECTIVITY

10  

Approx. 11 days

CoreStaff Part Number：st75102772

TE CONNECTIVITY 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 14 (2 x 7) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 20.0μin(0.51μm) 20.0μin(0.51μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

4-1571552-6
TE CONNECTIVITY

17  

Approx. 11 days

CoreStaff Part Number：st75102773

TE CONNECTIVITY 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 20 (2 x 10) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 20.0μin(0.51μm) 20.0μin(0.51μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

4-1571552-9
TE CONNECTIVITY

1  

Approx. 11 days

CoreStaff Part Number：st75102774

TE CONNECTIVITY 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 20.0μin(0.51μm) 20.0μin(0.51μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

5-1437535-4
TE CONNECTIVITY

5  

Approx. 11 days

CoreStaff Part Number：st75104667

TE CONNECTIVITY 500 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper
Quality Guaranteed
B-1 		Supplier Stock

5-1571552-2

5-1571552-2
TE CONNECTIVITY

3  

Approx. 11 days

CoreStaff Part Number：st75104868

TE CONNECTIVITY 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 40 (2 x 20) Solder -55°C ~ 105°C Open Frame Through Hole Tin-Lead Gold 20.0μin(0.51μm) Copper Alloy Copper Alloy Polyester
Quality Guaranteed
B-1 		Supplier Stock
20  

Approx. 11 days

CoreStaff Part Number：st65485092

Quality Guaranteed
B-1 		Supplier Stock

A81-A600X
SIEMENS

70 99  

Approx. 11 days

CoreStaff Part Number：st65401253

SIEMENS
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-1611-N
18 2007  

Approx. 4 days

CoreStaff Part Number：st30353636

Omron Electronics Inc-EMC Div XR2 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 16 (2 x 8) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-1621-N
42 2005  

Approx. 4 days

CoreStaff Part Number：st30353637

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Japanese Supplier
10 2008  

Approx. 4 days

CoreStaff Part Number：st30353638

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-2011-N
56 2002  

Approx. 4 days

CoreStaff Part Number：st30353639

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Japanese Supplier
45 2006  

Approx. 4 days

CoreStaff Part Number：st30353641

Omron Electronics Inc-EMC Div XR2 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier
34 2005  

Approx. 4 days

CoreStaff Part Number：st30353642

Omron Electronics Inc-EMC Div XR2 15.24 mm
Quality Guaranteed
B-1 		Supplier Stock
3 2005  

Approx. 4 days

CoreStaff Part Number：st60018582

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Japanese Supplier
30 2005  

Approx. 4 days

CoreStaff Part Number：st30353645

Omron Electronics Inc-EMC Div XR2 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier
50 2011  

Approx. 4 days

CoreStaff Part Number：st30353646

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Japanese Supplier
3 2008  

Approx. 4 days

CoreStaff Part Number：st30353647

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Quality Guaranteed
B-1 		Supplier Stock
500 2018  

Approx. 4 days

CoreStaff Part Number：st60028544

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-1

Authorized
Distributor
Supplier Stock

643648-1
TE CONNECTIVITY

138  

Approx. 5 days

CoreStaff Part Number：st68855655

Partner Stock

0009483031
RoHS

Certified
in Japan

   

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3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
CoreStaff Part Number：zp2216-WM2550-ND@0

Molex - Transistor, TO-220 - - 3 (Rectangular) Solder -40°C ~ 80°C Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) 100.0µin (2.54µm) Brass Brass Polyamide (PA66), Nylon 6/6
Partner Stock

0010182031
RoHS

Certified
in Japan

   

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3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
CoreStaff Part Number：zp2216-900-0010182031-ND@0

Molex 4038 Transistor, TO-220 0.100" (2.54mm) 0.100" (2.54mm) 3 (Rectangular) Solder - Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) - Brass Brass Polyester, Glass Filled
Partner Stock
RoHS

Certified
in Japan

   

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28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin-Lead Through Hole
CoreStaff Part Number：zp2216-900-0050395288-ND@0

Molex - DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) 28 (2 x 14) - - Closed Frame Through Hole - Tin-Lead - - - - -
Partner Stock

01-0503-20
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-20-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-21
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-21-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-30
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-30-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 30.0µin (0.76µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-31
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-31-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Gold Gold 30.0µin (0.76µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0508-20
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0508-20-ND@0

Aries Electronics 508 SIP - - 1 (1 x 1) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

01-0508-21
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0508-21-ND@0

Aries Electronics 508 SIP - - 1 (1 x 1) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

01-0508-30
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0508-30-ND@0

Aries Electronics 508 SIP - - 1 (1 x 1) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

01-0508-31
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0508-31-ND@0

Aries Electronics 508 SIP - - 1 (1 x 1) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

01-0513-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0513-10-ND@0

Aries Electronics 0513 SIP - - 1 (1 x 1) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0513-10H
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0513-10H-ND@0

Aries Electronics 0513 SIP - - 1 (1 x 1) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0513-10T
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0513-10T-ND@0

Aries Electronics 0513 SIP - - 1 (1 x 1) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0513-11
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0513-11-ND@0

Aries Electronics 0513 SIP - - 1 (1 x 1) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0513-11H
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0513-11H-ND@0

Aries Electronics 0513 SIP - - 1 (1 x 1) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0517-90C
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole, Right Angle
CoreStaff Part Number：zp2216-01-0517-90C-ND@0

Aries Electronics 0517 SIP - - 1 (1 x 1) Solder - - Through Hole, Right Angle Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-00
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Surface Mount
CoreStaff Part Number：zp2216-01-0518-00-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0518-10-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-10H
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0518-10H-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-10T
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0518-10T-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-11
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0518-11-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

01-0518-11H
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0518-11H-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 1 (1 x 1) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

02-0503-20
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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2 (1 x 2) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-02-0503-20-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 2 (1 x 2) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

02-0503-21
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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2 (1 x 2) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-02-0503-21-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 2 (1 x 2) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled

Recommended Rectifiers - IC/transistor sockets