IC/transistor sockets

Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Convert From (Adapter End) Convert To (Adapter End) Termination Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material

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CoreStaff Part Number		 Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Product Overview Convert From (Adapter End) Convert To (Adapter End) Termination Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material
Partner Stock

222-3343-19-0602
RoHS

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in Japan

   

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IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-19-222-3343-19-0602-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 22 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-09-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M2401-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-19-0602J
RoHS

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in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5018-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-29-0602J
RoHS

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in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5019-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-39-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5020-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-09-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5021-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-19-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5022-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-09-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M2801-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-19-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5023-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-19-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3937-228-1277-19-0602J-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-29-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5024-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-39-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5025-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-4817-09-0602J
RoHS

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in Japan

   

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IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5028-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

2299804-1

2299804-1
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Bolster Assembly For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125205-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets Cover - Silver Stainless Steel
Partner Stock

2299804-3

2299804-3
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Bolster Assembly For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125208-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets - - Silver Stainless Steel
Partner Stock

2299805-1

2299805-1
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Backplate For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125206-ND@0

TE Connectivity AMP Connectors - Backplate LGA 3647 Sockets - Nickel Silver Steel
Partner Stock

2299805-3

2299805-3
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Backplate For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125210-ND@0

TE Connectivity AMP Connectors - Backplate LGA 3647 Sockets - Nickel Silver Steel
Partner Stock

2299806-1

2299806-1
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Carrier For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125207-ND@0

TE Connectivity AMP Connectors - Carrier LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

2305234-1

2305234-1
TE CONNECTIVITY AMP CONNECTORS

Certified
in Japan

   

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Connector Cover For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125209-ND@0

TE Connectivity AMP Connectors - Cover LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

2310924-1

2310924-1
TE CONNECTIVITY AMP CONNECTORS

Certified
in Japan

   

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Connector Bolster Assembly For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125211-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets Cover - Silver Stainless Steel
Partner Stock

2310924-3

2310924-3
TE CONNECTIVITY AMP CONNECTORS

Certified
in Japan

   

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Connector Bolster Assembly For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125212-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets - - Silver Stainless Steel
Partner Stock

2310927-1

2310927-1
TE CONNECTIVITY AMP CONNECTORS

Certified
in Japan

   

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Connector Carrier For LGA 3647 Sockets
CoreStaff Part Number：zp2216-A125213-ND@0

TE Connectivity AMP Connectors - Carrier LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

232-1285-09-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5030-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

232-1285-19-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5031-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

232-1285-29-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5032-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

2351051-1

2351051-1
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Back Plate For
CoreStaff Part Number：zp2216-17-2351051-1-ND@0

TE Connectivity AMP Connectors - Back Plate - - - Black -
Partner Stock

2351051-2

2351051-2
TE CONNECTIVITY AMP CONNECTORS

RoHS

Certified
in Japan

   

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Connector Back Plate For
CoreStaff Part Number：zp2216-17-2351051-2-ND@0

TE Connectivity AMP Connectors - Back Plate - - - Black -
Partner Stock

24-350000-10-HT
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SOIC To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-350000-10-HT-ND@0

Aries Electronics Correct-A-Chip® 350000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead Tin - Polyimide (PI)
Partner Stock

24-351000-10
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SSOP To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-351000-10-ND@0

Aries Electronics Correct-A-Chip® 351000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
Partner Stock

24-351000-11-RC
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter SSOP To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-351000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 351000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
Partner Stock

24-354000-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
CoreStaff Part Number：zp2216-24-354000-10-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
Partner Stock

24-354000-11-RC
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
CoreStaff Part Number：zp2216-24-354000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
Partner Stock

24-354000-20
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
CoreStaff Part Number：zp2216-24-354000-20-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
Partner Stock

24-354000-21-RC
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
CoreStaff Part Number：zp2216-24-354000-21-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
Partner Stock

24-35W000-10
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-35W000-10-ND@0

Aries Electronics Correct-A-Chip® 35W000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC-W DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
Partner Stock

24-35W000-11-RC
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-35W000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 35W000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC-W DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold - - FR4 Epoxy Glass
Partner Stock

24-650000-10-P
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-650000-10-P-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
Partner Stock

24-650000-11-RC

24-650000-11-RC
ARIES ELECTRONICS

RoHS

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in Japan

   

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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-A754-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
Partner Stock

24-650000-11-RC-P
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-650000-11-RC-P-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
Partner Stock

24-651000-10
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SSOP To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-24-651000-10-ND@0

Aries Electronics Correct-A-Chip® 651000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
Partner Stock

24-665000-00
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SOIC-W To SOIC Surface Mount
CoreStaff Part Number：zp2216-24-665000-00-ND@0

Aries Electronics Correct-A-Chip® 665000 0.050" (1.27mm) 0.050" (1.27mm) 24 SOIC-W SOIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

24-666000-00
ARIES ELECTRONICS

Certified
in Japan

   

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IC Socket Adapter SOIC To SOWIC Surface Mount
CoreStaff Part Number：zp2216-24-666000-00-ND@0

Aries Electronics Correct-A-Chip® 666000 0.050" (1.27mm) 0.050" (1.27mm) 24 SOIC SOWIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

240-1280-09-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M4001-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

240-1280-19-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5034-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

240-1280-29-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5035-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

240-1280-39-0602J
RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5036-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

240-3639-09-0602J
RoHS

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in Japan

   

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IC Socket Adapter DIP, 1.0" (25.40mm) Row Spacing To DIP, 1.0" (25.40mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5037-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

240-3639-19-0602J
RoHS

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in Japan

   

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IC Socket Adapter DIP, 1.0" (25.40mm) Row Spacing To DIP, 1.0" (25.40mm) Row Spacing Through Hole
CoreStaff Part Number：zp2216-3M5038-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -

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