IC/transistor sockets

Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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Stock Type
Supplier Rank		 Supplier Stock Location Image Part number /
Manufacturer / More information		 QTY Date
Code		 Unit Price Minimum Order Quantity /
Standard Packing Quantity		 Estimated Ship Date ECAD Model Description
CoreStaff Part Number		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock
10 N/A

MOQ : 3
SPQ : 1

Detail

CoreStaff Part Number：st61431222

Omron Electronics Inc-EMC Div XR2 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 20 (2 x 10) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

XR2A-2011-N
5 N/A

MOQ : 3
SPQ : 1

Detail

CoreStaff Part Number：st61431223

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock
5 N/A

MOQ : 4
SPQ : 1

Detail

CoreStaff Part Number：st61431224

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location
RoHS
10 N/A

MOQ : 3
SPQ : 1

Detail

CoreStaff Part Number：st50002590

Omron Electronics Inc-EMC Div XR2 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

XR2A-2811-N
15 N/A

MOQ : 3
SPQ : 1

Detail

CoreStaff Part Number：st61431226

Omron Electronics Inc-EMC Div XR2 15.24 mm
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location
RoHS
1 N/A

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number：st50002591

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location
RoHS
5 N/A

MOQ : 2
SPQ : 1

Detail

CoreStaff Part Number：st50002592

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock
4 N/A

MOQ : 2
SPQ : 1

Detail

CoreStaff Part Number：st61431227

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock
1 N/A

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number：st61431228

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock
1 N/A

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number：st61431229

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location

XR2C-3211-N
RoHS
5 N/A

MOQ : 2
SPQ : 1

Detail

CoreStaff Part Number：st50002593

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location

XR2P-1041
OMRON

RoHS
4 N/A

MOQ : 2
SPQ : 1

Detail

CoreStaff Part Number：st50002594

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-2 		corestaff

Authorized
Distributor
CoreStaff Thailand stock

Overseas Location

XR2P-2041

XR2P-2041
OMRON

RoHS
1 N/A

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number：st50002595

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Stock type
Supplier Rank		 Supplier Stock Location Image Part number /
Manufacturer / Other		 QTY Date
code		 Unit price Minimum /
Multiple		 Expected shipping date ECAD Model Description
CoreStaff part #		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
Excess stock/Consignment stock
Quality Guaranteed
B-1 		Supplier Stock

1-1814655-1

1-1814655-1
TE CONNECTIVITY

12  

CoreStaff Part Number：st75086374

TE CONNECTIVITY SIP 0.100" (2.54mm) 0.100" (2.54mm) 16 (1 x 16) Solder -55°C ~ 125°C Closed Frame Through Hole Tin Gold 196.9μin(5.00μm) Flash Brass Beryllium Copper Thermoplastic, Polyester
Quality Guaranteed
B-1 		Supplier Stock
30  

CoreStaff Part Number：st65482341

Quality Guaranteed
B-1 		Supplier Stock

1-2199298-2
TE CONNECTIVITY

1  

CoreStaff Part Number：st75087388

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Supplier Stock

1-2199298-2
TE CONNECTIVITY

200 22+  

CoreStaff Part Number：st75023655

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Supplier Stock

1-2199298-8
TE CONNECTIVITY

18  

CoreStaff Part Number：st75087389

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Supplier Stock

1-2199298-9
TE CONNECTIVITY

5  

CoreStaff Part Number：st75087390

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Supplier Stock

1-2324271-3
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

CoreStaff Part Number：st72738096

Quality Guaranteed
B-1 		Supplier Stock

1-2324271-4
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

CoreStaff Part Number：st72738097

TE CONNECTIVITY LGA 4189 0.034" (0.86mm) 0.039" (1.00mm) 2092 Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

1-2324271-4
TE CONNECTIVITY

5  

CoreStaff Part Number：st75087536

TE CONNECTIVITY LGA 4189 0.034" (0.86mm) 0.039" (1.00mm) 2092 Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

1-390261-3
TE CONNECTIVITY

4,066  

CoreStaff Part Number：st72143737

Quality Guaranteed
B-1 		Supplier Stock

1-822473-7
TE CONNECTIVITY

76  

CoreStaff Part Number：st72143764

Quality Guaranteed
B-1 		Supplier Stock
10  

CoreStaff Part Number：st75084775

MOLEX 3099 0.198" (5.03mm) Solder Board Guide Through Hole Tin Tin 200.0µin (5.08µm)
Quality Guaranteed
B-1 		Supplier Stock
12  

CoreStaff Part Number：st75084776

MOLEX 3099 0.198" (5.03mm) Solder Board Guide Through Hole Tin Tin 200.0µin (5.08µm)
Quality Guaranteed
B-1 		Supplier Stock
413 19  

CoreStaff Part Number：st65329491

MILL-MAX 110 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -55°C ~ 125°C Open Frame Through Hole Tin Gold 200.0μin(5.08μm) 30.0μin(0.76μm) Brass Alloy Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

1554653-1
TE CONNECTIVITY

5  

CoreStaff Part Number：st75089611

TE CONNECTIVITY LGA 2011(47 x 58) Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

1571552-2
TE CONNECTIVITY

8  

CoreStaff Part Number：st75089701

Quality Guaranteed
B-1 		Supplier Stock

1571552-6
TE CONNECTIVITY

10  

CoreStaff Part Number：st75089702

Quality Guaranteed
B-1 		Supplier Stock

1814655-5
TE CONNECTIVITY

10  

CoreStaff Part Number：st75092696

TE CONNECTIVITY SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 29.5μin(0.75μm) 29.5μin(0.75μm) Brass Beryllium Copper Thermoplastic, Polyester
Quality Guaranteed
B-1 		Supplier Stock

2-1571550-4

2-1571550-4
TE CONNECTIVITY

11  

CoreStaff Part Number：st75096000

TE CONNECTIVITY 500 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 16 (2 x 8) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) Beryllium Copper Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

2-1571550-9
TE CONNECTIVITY

5  

CoreStaff Part Number：st75096001

TE CONNECTIVITY 500 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) Beryllium Copper Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

2-1571552-6

2-1571552-6
TE CONNECTIVITY

11  

CoreStaff Part Number：st75096003

Quality Guaranteed
B-1 		Supplier Stock

2-1571586-9
TE CONNECTIVITY

11  

CoreStaff Part Number：st75096004

TE CONNECTIVITY 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Quality Guaranteed
B-1 		Supplier Stock

2-2129710-5
TE CONNECTIVITY

1  

CoreStaff Part Number：st75096511

TE CONNECTIVITY LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin(0.76μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

2-2129710-6
TE CONNECTIVITY

2  

CoreStaff Part Number：st75096512

TE CONNECTIVITY LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin(0.76μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

CoreStaff Part Number：st70632473

Quality Guaranteed
B-1 		Supplier Stock

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

CoreStaff Part Number：st70632474

Quality Guaranteed
B-1 		Supplier Stock

2-2330551-1
TE CONNECTIVITY

1  

CoreStaff Part Number：st75096728

Quality Guaranteed
B-1 		Supplier Stock

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

CoreStaff Part Number：st70632476

Quality Guaranteed
B-1 		Supplier Stock

2134439-2
TE CONNECTIVITY

4  

CoreStaff Part Number：st75095741

Quality Guaranteed
B-1 		Supplier Stock

2134440-3
TE CONNECTIVITY

4  

CoreStaff Part Number：st75095742

Quality Guaranteed
B-1 		Supplier Stock

2201838-1
TE CONNECTIVITY

3  

CoreStaff Part Number：st75096380

TE CONNECTIVITY LGA 0.035" (0.90mm) 0.040" (1.02mm) 2011(47 x 58) Solder Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

2201838-2
TE CONNECTIVITY

3  

CoreStaff Part Number：st75096381

Quality Guaranteed
B-1 		Supplier Stock

2287402-1
TE CONNECTIVITY

10  

CoreStaff Part Number：st75096836

TE CONNECTIVITY LGA 0.036" (0.91mm) 0.036" (0.91mm) 1151 Solder Closed Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
Quality Guaranteed
B-1 		Supplier Stock

2299806-1
TE CONNECTIVITY

6  

CoreStaff Part Number：st75096921

Quality Guaranteed
B-1 		Supplier Stock

3-1571552-6

3-1571552-6
TE CONNECTIVITY

10  

CoreStaff Part Number：st75100181

Recommended Rectifiers - IC/transistor sockets