R5F572MDDDBD#20
RENESAS
RoHS Status:PBF
Stock Type:Quality-guaranteed
CoreStaff Part Number:st76606426
Date Code:22/23+
Images are for reference only.
Please see Product Specifications
for details.
Documents
Product Specifications
| Case/Package | LFBGA |
| China RoHS | Compliant |
| Core Architecture | RXv3 |
| Export Control Classification Number (ECCN) Code | 3A991 |
| Part Family | RX |
| Frequency | 240 MHz |
| Height | 1.4 mm |
| Harmonized Tariff Schedule (HTS) Code | 8542.31.0001 |
| Interface | I2C, SPI, UART |
| Introduction Date | 2019-05-23 |
| Lifecycle Status | Production (Last Updated: 3 weeks ago) |
| Manufacturer Lifecycle Status | ACTIVE (Last Updated: 3 weeks ago) |
| Max Frequency | 240 MHz |
| Max Input Voltage | 3.6 V |
| Max Operating Temperature | 85 °C |
| Max Supply Voltage | 3.6 V |
| Memory Size | 2 MB |
| Memory Type | FLASH |
| Min Input Voltage | 2.7 V |
| Min Operating Temperature | -40 °C |
| Min Supply Voltage | 2.7 V |
| MSL | 3 |
| Mount | Surface Mount |
| Number of I2C Channels | 16 |
| Number of I/Os | 182 |
| Number of Pins | 224 |
| Number of SPI Channels | 16 |
| Number of Terminals | 224 |
| Number of UART Channels | 13 |
| Pitch | 800 µm |
| RAM Size | 1 MB |
| REACH SVHC | Yes |
| Part Series | RX700 |
| Terminal Pitch | 800 µm |
| Width | 13 mm |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
In Stock: 58
MOQ:58
SPQ:1
