- Top >
- 半导体 >
- 射频-分立器件/集成电路/模块 >
- Balun >
- HHM1779B1(TDK)
HHM1779B1
本公司如有多个同型号产品同时显示时，不一定只限于上述图像的产品。
需要详细资讯时，请点击上面客服洽询与我们联络。
文档
产品属性
| Case/Package | 0603 |
| Case Code (Imperial) | 0603 |
| Case Code (Metric) | 1608 |
| China RoHS | Compliant |
| Height | 600 µm |
| Insertion Loss (dB) | 0.8 dB |
| Introduction Date | 2007-06-26 |
| Lifecycle Status | EOL (Last Updated: 3 years ago) |
| LTB Date | 2023-03-31 |
| LTD Date | 2024-03-31 |
| Manufacturer Lifecycle Status | EOL ANNOUNCED (Last Updated: 3 years ago) |
| Max Length | 1.7 mm |
| Max Operating Temperature | 85 °C |
| Max Thickness | 700 µm |
| Max Width | 900 µm |
| Min Length | 1.5 mm |
| Min Operating Temperature | -40 °C |
| Min Thickness | 500 µm |
| Min Width | 700 µm |
| Mount | Surface Mount |
| Number of Pins | 6 |
| Packaging | Tape & Reel |
| Radiation Hardening | No |
| REACH SVHC | Unaffected |
| Termination | SMD/SMT |
| Width | 800 µm |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
库存量: 257
MOQ:257
SPQ:1
| 购买数量 | 单价(FOB JAPAN) |
|---|---|
| 257 - | $0.286 |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
