SP03-3.3BTG
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产品属性
| Breakdown Voltage | 3.3 V |
| Capacitance | 16 pF |
| Case/Package | SOIC |
| Clamping Voltage | 18 V |
| Depth | 4 mm |
| Direction | Bidirectional |
| Element Configuration | Dual |
| Height | 1.65 mm |
| Lead Free | Lead Free |
| Leakage Current | 1 µA |
| Lifecycle Status | Production (Last Updated: 2 months ago) |
| Max Breakdown Voltage | 3.3 V |
| Max Operating Temperature | 150 °C |
| Max Power Dissipation | 3.3 kW |
| Max Reverse Leakage Current | 1 µA |
| Max Surge Current | 150 A |
| Min Breakdown Voltage | 3.3 V |
| Min Operating Temperature | -55 °C |
| Mount | Surface Mount |
| Number of Channels | 2 |
| Number of Circuits | 2 |
| Number of Elements | 1 |
| Number of Pins | 8 |
| Number of Terminals | 8 |
| Packaging | Cut Tape |
| Peak Pulse Current | 150 A |
| Peak Pulse Power | 3.3 kW |
| Polarity | Unidirectional |
| Radiation Hardening | No |
| REACH SVHC | Yes |
| Reverse Breakdown Voltage | 3.3 V |
| Reverse Standoff Voltage | 3.3 V |
| Schedule B | 8536300000, 8536300000|8536300000|8536300000|8536300000|8536300000 |
| Termination | SMD/SMT |
| Test Current | 50 µA |
| Width | 4 mm |
| Working Voltage | 3.3 V |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
