IC/transistor sockets

Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range
 
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CoreStaff Part Number
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
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A-1
corestaff CoreStaff Japan stock

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0

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Packaging:bulk

3M Textool™ トランジスタ, TO-3およびTO-66 0.234" (5.94mm) 3 (Rectangular) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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A-1
corestaff CoreStaff Japan stock

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966
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3M Textool™ SOIC 1.27 mm 8 (2 x 4) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
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A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 400

MOQ : 1
SPQ : 1

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Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 14 (2 x 7) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

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28
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MOQ : 1
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Packaging:bulk

3M Textool™ SOIC 1.27 mm 14 (2 x 7) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 800

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 16 (2 x 8) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory

216-7224-55-1902

RoHS
0

On Order : 50

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 16 (2 x 8) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory

216-7383-55-1902

RoHS
12
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 16 (2 x 8) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 120

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 18 (2 x 9) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
4
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 18 (2 x 9) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
200
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 20 (2 x 10) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory

220-7201-55-1902

RoHS
10
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 20 (2 x 10) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 200

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
76
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 24 (2 x 12) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
100
Real-time
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On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory

228-1371-00-0602J

RoHS
0

On Order : 400

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
7
Real-time
Stock Quantity


On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:bulk

3M Textool™ SOIC 1.27 mm 28 (2 x 14) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 0.76μm Beryllium Copper Beryllium Copper ポリエーテルスルホン(PES), ガラス充填
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 100

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 32 (2 x 16) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
160
Real-time
Stock Quantity


On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 40 (2 x 20) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 100

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 40 (2 x 20) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 50

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.070" (1.78mm) 42 (2 x 21) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory

248-1282-00-0602J

RoHS
200
Real-time
Stock Quantity


On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 48 (2 x 24) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
corestaff CoreStaff Japan stock

Our Inventory
RoHS
0

On Order : 0

MOQ : 1
SPQ : 1

Detail

Packaging:stick/tube

3M Textool™ DIP, ZIF(ZIP), 0.9" (22.86mm)行間隔 0.070" (1.78mm) 0.070" (1.78mm) 64 (2 x 32) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-4
Supplier Stock

RoHS
10 2019

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number:st73796040

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 40 (2 x 20) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Stock type
Supplier Rank
Supplier Stock Location Image Part number /
Manufacturer / Other
QTY Date
code
Unit price Minimum /
Multiple
Expected shipping date ECAD Model Description
CoreStaff part #
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
Excess stock/Consignment stock
Quality Guaranteed
B-1
Supplier Stock

814

MOQ : 3
SPQ : 1

Detail

CoreStaff Part Number:st64687829

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Quality Guaranteed
B-1
Supplier Stock

248-1282-00-0602J

94

MOQ : 2
SPQ : 1

Detail

CoreStaff Part Number:st64688036

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 48 (2 x 24) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Quality Guaranteed
B-1
Supplier Stock

22

MOQ : 1
SPQ : 1

Detail

CoreStaff Part Number:st63466141

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

10  

Certified in Japan
CoreStaff Part Number:st75557910

3M Textool™ トランジスタ, TO-3およびTO-66 0.234" (5.94mm) 3 (Rectangular) Solder -55°C ~ 150°C Closed Frame Through Hole Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Franchise Stock
A-1
Supplier Stock

31  

Certified in Japan
CoreStaff Part Number:st75557622

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 14 (2 x 7) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

11  

Certified in Japan
CoreStaff Part Number:st75557623

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 16 (2 x 8) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

4  

Certified in Japan
CoreStaff Part Number:st75557626

3M Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 18 (2 x 9) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

6  

Certified in Japan
CoreStaff Part Number:st75557634

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

3  

Certified in Japan
CoreStaff Part Number:st75557643

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 40 (2 x 20) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

1  

Certified in Japan
CoreStaff Part Number:st75557646

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.070" (1.78mm) 42 (2 x 21) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Franchise Stock
A-1
Supplier Stock

248-1282-00-0602J

2  

Certified in Japan
CoreStaff Part Number:st75557647

3M Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 48 (2 x 24) Press-Fit -55°C ~ 125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), Glass Filled
Partner Stock

214-3339-09-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M1401-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 14 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

214-3339-19-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5013-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 14 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

216-3340-09-0602J

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M1601-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 16 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

216-3340-19-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5014-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 16 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

218-3341-19-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5015-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 18 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

220-3342-09-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M2001-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 20 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

220-3342-19-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5016-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 20 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

222-3343-19-0602

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-19-222-3343-19-0602-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 22 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-09-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M2401-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-19-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5018-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-29-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5019-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-39-0602J

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5020-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-09-0602J

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5021-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-19-0602J

RoHS

Certified
in Japan

   

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M5022-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-09-0602J

RoHS

Certified
in Japan

   

View Details

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
CoreStaff Part Number:zp2216-3M2801-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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